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热门关键词：
| 项目 Project | 标准 Standard | 可达 Up to |
| 最大层數 Max. Layer count | 32 | 64 |
| 最大尺寸 Max. size | 850*610mm | 1200*610mm |
| 最厚板厚 Max. thickness board | 6mm | 10mm |
| 最薄板厚 Min. thickness board | 0.15mm(双面) 0.33mm(四层) 0.15mm(Double-sided) 0.33mm(Four Layer) | 0.12mm(双面) 0.28mm(四层) 0.15mm(Double-sided) 0.28mm(Four Layer) |
| 最厚表铜 Max. thickness of surface copper | 6OZ | 12OZ |
| 线宽/线距 Trace width / spacing | 0.075mm/0.075mm | 0.075mm/0.065mm |
| 最小绿油桥 Min. green ink bridge | 0.10mm | 0.075mm |
| 最小机械钻孔 Min. Mechanical Drlling | 0.20mm | 0.15mm |
| 最小激光钻孔 Min. laser Drlling | 0.10mm | 0.10mm |
| 外型公差 Outline tolerance | ±0.1mm | ±0.05mm |
| 最小金属孔焊盘 Min. Blind or Buride via PAD | 0.45mm | 0.40mm |
| 金属孔厚径比 Metal pore thickness-to-diameter ratio | 10:1 | 12:1 |
| 孔位公差 Hole Position Tolerance | ±0.05mm | ±0.05mm |
| 特性阻抗/差分阻抗 Characteristic impedance/differential impedance | ±10% | ±8% |
| 翘曲度 Bow and twist | 0.75% | 0.50% |
| 板材 Material | FR4板（指定品牌物料：如建滔、生益、联茂、 南亚、台光台耀等)、高频板、铁氟龙板、陶瓷 板、罗杰斯板等. FR4（Specify branded items：Such as KB, Shengyi, ITEQ, Nanya, EMC, TUC and so on)、High frequency board、Teflon、Ceramic board、Rogers board, etc. | |
| 表面处理 Surface treatment | 沉金/防氧化/镀金 (软/硬) /喷锡/沉银/沉锡/镀锡/碳油/金手指 immersion gold/OSP/plating Gold (soft/hard) /hot air leveling (HASL)/immersion Silver/immersion Tin/plating Tin/Carbon ink/Gold-finger | |
| 特殊工艺 Special process | 半孔、高Tg板、混合压板、无卤素板、超薄超厚板、 邦定、阻抗、蓝胶、碳油、电厚金、镍钯金、金手 指、盲锣、埋盲孔、沉头孔、树脂塞孔、软硬结合板、HDI等. Half hole、High Tg board、Mix laminated board、Halogen-free Board、Super thin/thick board、 Bonding board、Impedance board、Peelable blue mask、Carbon Ink board、Thick Gold-plated 、ENEPIG board、Gold-finger、Blind routing、Blind Buried via hole、Countersunk holes、Resin plug holes、Rigid-Flex Board 、HDI and so on. | |